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1 ионно-плазменное распыление
Microelectronics: ion-plasma sputtering, plasma-assisted ion sputteringУниверсальный русско-английский словарь > ионно-плазменное распыление
См. также в других словарях:
Sputtering — Pulvérisation cathodique La pulvérisation cathodique est une méthode de dépôt de couche mince. Sommaire 1 Principe 1.1 Synthèse de films céramiques 1.2 Instabilité électrique … Wikipédia en Français
Ion plating — is a physical vapor deposition (PVD) process that is sometimes called ion assisted deposition (IAD) or ion vapor deposition (IVD) and is a version of vacuum deposition . Ion plating utilizes concurrent or periodic bombardment of the substrate and … Wikipedia
Pulvérisation cathodique (sputtering) — Pulvérisation cathodique La pulvérisation cathodique est une méthode de dépôt de couche mince. Sommaire 1 Principe 1.1 Synthèse de films céramiques 1.2 Instabilité électrique … Wikipédia en Français
Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… … Wikipedia
Pulvérisation cathodique — Pour les articles homonymes, voir Pulvérisation. La pulvérisation cathodique (ou sputtering) est une méthode de dépôt de couche mince. Il s agit d une technique qui autorise la synthèse de plusieurs matériaux à partir de la condensation d’une… … Wikipédia en Français
Pulverisation cathodique — Pulvérisation cathodique La pulvérisation cathodique est une méthode de dépôt de couche mince. Sommaire 1 Principe 1.1 Synthèse de films céramiques 1.2 Instabilité électrique … Wikipédia en Français
Vacuum deposition — Not to be confused with Vacuum coating. Vacuum deposition is a family of processes used to deposit layers atom by atom or molecule by molecule at sub atmospheric pressure (vacuum) on a solid surface. The layers may be as thin as one atom to… … Wikipedia
integrated circuit — Electronics. a circuit of transistors, resistors, and capacitors constructed on a single semiconductor wafer or chip, in which the components are interconnected to perform a given function. Abbr.: IC Also called microcircuit. [1955 60] * * * ▪… … Universalium
Copper indium gallium selenide solar cells — Copper indium gallium selenide (CuIn1 xGaxSe2 or CIGS) is a direct bandgap semiconductor useful for the manufacture of solar cells. Because the material strongly absorbs sunlight, a much thinner film is required than of other semiconductor… … Wikipedia
Photonic metamaterial — Electromagnetism Electricity · … Wikipedia
Nitriding — is a heat treating process that diffuses nitrogen into the surface of a metal to create a case hardened surface. It is predominantly used on steel, but also titanium, aluminum and molybdenum. Typical applications include gears, crankshafts,… … Wikipedia